Miniaturized Millimeter-Wave Multilayer Filter Design Using Additive Manufacturing

Sturim, Nicholas; Chahal, Premjeet; Hodek, Matthew; Albrecht, John D.; Papapolymerou, John

doi:10.1109/tcpmt.2025.3564215

Miniaturized Millimeter-Wave Multilayer Filter Design Using Additive Manufacturing

Journal Article · Thu Apr 24 00:00:00 EDT 2025 · IEEE Transactions on Components, Packaging, and Manufacturing Technology

DOI:https://doi.org/10.1109/tcpmt.2025.3564215· OSTI ID:2584309

^[1]; Chahal, Premjeet ^[1]; ^[1]; ^[1]; ^[1]

Michigan State Univ., East Lansing, MI (United States)

Here, this article presents an innovative, fully additive manufactured approach to millimeter-wave multilayer circuits. An aerosol jet printer is used to fabricate a multilayer stepped-impedance low-pass filter. By leveraging the second layer for miniaturization, we achieve a more compact design. By precisely controlling conductor separation and utilizing 3-D printing technology, we were able to optimize the width of the high- and low-impedance segments for optimal filter performance. Two filter types were successfully fabricated: a low-pass microstrip filter and a low-pass stripline filter, both with a cutoff frequency near 29 GHz and exhibiting acceptable stopband attenuation. The stripline configuration allows for a 36% decrease in the stripline waveguide conductor area while achieving a great passband insertion loss of just 0.62 dB, enabled by aerosol jet printing (AJP). The line loss of both designs was characterized using a microstrip through line and a stripline through line. Both designs demonstrated low overall loss, with the microstrip line exhibiting a loss of 0.26 dB/mm and the stripline having a loss of 0.37 dB/mm at 29 GHz. This work demonstrates a multilayer integration solution and offers an advantage in reducing the size of RF circuits such as filter banks for next-generation integrated RF front ends.

View Accepted Manuscript (DOE)

Research Organization:: Kansas City Plant (KCP), Kansas City, MO (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

Grant/Contract Number:: NA0002839

OSTI ID:: 2584309

Report Number(s):: NSC-614-6724

Journal Information:: IEEE Transactions on Components, Packaging, and Manufacturing Technology, Journal Name: IEEE Transactions on Components, Packaging, and Manufacturing Technology Journal Issue: 6 Vol. 15; ISSN 2156-3985; ISSN 2156-3950

Publisher:: IEEECopyright Statement

Country of Publication:: United States

Language:: English

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