Device- and System-Level Thermal Packaging for Electric-Drive Technologies (Final Technical Report)

Technical Report · Sat Jun 14 00:00:00 EDT 2025

DOI:https://doi.org/10.2172/2569385· OSTI ID:2569385

Joshi, Yogendra ^[1]; Graham, Samuel ^[2]; Kumar, Satish ^[1]

---

1. Georgia Institute of Technology, Atlanta, GA (United States)
2. Univ. of Maryland, College Park, MD (United States)

Final Technical ReportThis project aimed to research, develop, and test electric traction drive system technology for use in vehicle applications that are capable of meeting the targets set by the Department of Energy Vehicle Technologies Office. The project is categorized into three major thrusts: Bonding interfaces for packaging, thermal management of electric vehicle (EV) power inverters, and electric motor thermal management. Device- and System-Level Thermal Packaging for Electric-Drive Technologies project aimed to develop, analyze, and validate transformative approaches in thermal management and packaging for power electronics and electric motor systems, with the ultimate goal of enhancing power density, efficiency, and reliability in electrified transportation platforms.

• Research Organization: National Energy Technology Laboratory (NETL), Pittsburgh, PA, Morgantown, WV, and Albany, OR (United States); Georgia Institute of Technology, Atlanta, GA (United States)
• Sponsoring Organization: USDOE Office of Energy Efficiency and Renewable Energy (EERE), Office of Sustainable Transportation. Vehicle Technologies Office (VTO)
• DOE Contract Number: EE0008708
• OSTI ID: 2569385
• Report Number(s): DOE-EE--0008708-Georgia-Tech
• Country of Publication: United States
• Language: English