Microbead Encapsulation for Protection of Electronic Components

Hill, Jeffrey R.; Chen, Alex; Wilson, Natasha Jensen; Boll, Cayden; O’Bannon, MeiLi; Trentman, Dallan

doi:10.1115/1.4067650

Microbead Encapsulation for Protection of Electronic Components

Journal Article · Mon Feb 03 23:00:00 EST 2025 · Journal of Electronic Packaging

DOI:https://doi.org/10.1115/1.4067650· OSTI ID:2520596

^[1]; Chen, Alex ^[2]; Wilson, Natasha Jensen ^[2]; Boll, Cayden ^[2]; O’Bannon, MeiLi ^[1]; Trentman, Dallan ^[1]

Brigham Young Univ., Provo, UT (United States)
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Here, this study investigates the application of microbeads as an innovative encapsulation technique to protect electronic components from harsh mechanical strain. Traditional encapsulation methods using hard epoxy provide substantial mechanical support but create thermal expansion mismatch issues, potentially leading to electronic component failure. We explore the use of finely powdered microbeads to achieve protective structures combining stiffness and energy absorption. The research focuses on key variables, including microbead size, microbead roughness, compaction of microbeads, and circuit board mounting in the encapsulation, all of which influence the encapsulation’s effectiveness. Experimental setups and testing protocols were developed to assess the performance of various microbead materials under different impact conditions. Results demonstrate that microbead encapsulation significantly reduces strain on circuit boards, minimizing the risk of damage during mechanical shocks. However, challenges remain, such as optimizing microbead characteristics and modeling their behavior within large-scale circuit board assemblies. Despite these challenges, the findings suggest that microbead encapsulation offers a promising alternative to conventional methods, enhancing the durability and reliability of electronic components in high-stress environments.

View Accepted Manuscript (DOE)

Research Organization:: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

Grant/Contract Number:: NA0003525

OSTI ID:: 2520596

Report Number(s):: SAND--2025-02054J

Journal Information:: Journal of Electronic Packaging, Journal Name: Journal of Electronic Packaging Journal Issue: 2 Vol. 147; ISSN 1043-7398

Publisher:: ASMECopyright Statement

Country of Publication:: United States

Language:: English

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