Nanoscale Three-Dimensional Imaging of Integrated Circuits Using a Scanning Electron Microscope and Transition-Edge Sensor Spectrometer
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- National Institute of Standards and Technology (NIST), Boulder, CO (United States); Univ. of Colorado, Boulder, CO (United States)
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- National Institute of Standards and Technology (NIST), Boulder, CO (United States)
- National Institute of Standards and Technology (NIST), Gaithersburg, MD (United States)
X-ray nanotomography is a powerful tool for the characterization of nanoscale materials and structures, but it is difficult to implement due to the competing requirements of X-ray flux and spot size. Due to this constraint, state-of-the-art nanotomography is predominantly performed at large synchrotron facilities. We present a laboratory-scale nanotomography instrument that achieves nanoscale spatial resolution while addressing the limitations of conventional tomography tools. The instrument combines the electron beam of a scanning electron microscope (SEM) with the precise, broadband X-ray detection of a superconducting transition-edge sensor (TES) microcalorimeter. The electron beam generates a highly focused X-ray spot on a metal target held micrometers away from the sample of interest, while the TES spectrometer isolates target photons with a high signal-to-noise ratio. This combination of a focused X-ray spot, energy-resolved X-ray detection, and unique system geometry enables nanoscale, element-specific X-ray imaging in a compact footprint. The proof of concept for this approach to X-ray nanotomography is demonstrated by imaging 160 nm features in three dimensions in six layers of a Cu-SiO2 integrated circuit, and a path toward finer resolution and enhanced imaging capabilities is discussed.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA); Intelligence Advanced Research Projects Activity (IARPA); US Department of Commerce
- Grant/Contract Number:
- NA0003525
- OSTI ID:
- 2469889
- Journal Information:
- Sensors, Journal Name: Sensors Journal Issue: 9 Vol. 24; ISSN 1424-8220
- Publisher:
- MDPI AGCopyright Statement
- Country of Publication:
- United States
- Language:
- English
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