Superplastic creep of AuSn eutectic solder alloy

Elmer, J. W.; Mulay, R. P.

doi:10.1016/j.scriptamat.2016.03.031

Superplastic creep of AuSn eutectic solder alloy

Journal Article · Tue Apr 19 00:00:00 EDT 2016 · Scripta Materialia

DOI:https://doi.org/10.1016/j.scriptamat.2016.03.031· OSTI ID:2449724

Elmer, J. W. ^[1]; Mulay, R. P. ^[1]

Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)

The large-strain tensile creep behavior of Au₈₀Sn₂₀ wt.% eutectic was studied at temperatures between 125 °C and 200 °C. Constant load creep experiments were performed and a power law relationship was created from this data to predict creep as a function of stress and temperature with a best-fit stress exponent n = 2.1 and activation energy for creep of Q = 148.4 kJ/mol. Results show that the favorable creep resistance of AuSn reduces considerably at temperatures above 125 °C, having 1000× higher creep rate at 200 °C than 125 °C. Finally, of particular note is the observation of superplasticity in AuSn, with failure strains reaching 740% at 200 °C.

Research Organization:: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)

Sponsoring Organization:: USDOE; USDOE National Nuclear Security Administration (NNSA)

Grant/Contract Number:: AC52-07NA27344

OSTI ID:: 2449724

Alternate ID(s):: OSTI ID: 1346262

Report Number(s):: LLNL-JRNL-865628; 806885

Journal Information:: Scripta Materialia, Journal Name: Scripta Materialia Vol. 120; ISSN 1359-6462

Publisher:: ElsevierCopyright Statement

Country of Publication:: United States

Language:: English

References (9)

Interpretation of superplastic flow in terms of a threshold stress Mohamed, Farghalli A. Journal of Materials Science, Vol. 18, Issue 2 https://doi.org/10.1007/BF00560647	journal	February 1983
Superplastic creep of low melting point solder joints Mei, Z.; Morris, J. W. Journal of Electronic Materials, Vol. 21, Issue 4 https://doi.org/10.1007/BF02660403	journal	April 1992
Superplasticity Edington, J. W.; Melton, K. N.; Cutler, C. P. Progress in Materials Science, Vol. 21, Issue 1-2 https://doi.org/10.1016/0079-6425(76)90005-0	journal	January 1976
The AuSn phase diagram Ciulik, J.; Notis, M. R. Journal of Alloys and Compounds, Vol. 191, Issue 1 https://doi.org/10.1016/0925-8388(93)90273-P	journal	January 1993
Creep behavior of eutectic 80Au/20Sn solder alloy Zhang, G. S.; Jing, H. Y.; Xu, L. Y. Journal of Alloys and Compounds, Vol. 476, Issue 1-2 https://doi.org/10.1016/j.jallcom.2008.09.009	journal	May 2009
Design of lead-free candidate alloys for high-temperature soldering based on the Au–Sn system Chidambaram, Vivek; Hattel, Jesper; Hald, John Materials & Design, Vol. 31, Issue 10 https://doi.org/10.1016/j.matdes.2010.05.035	journal	December 2010
Development of high-temperature solders: Review Zeng, Guang; McDonald, Stuart; Nogita, Kazuhiro Microelectronics Reliability, Vol. 52, Issue 7 https://doi.org/10.1016/j.microrel.2012.02.018	journal	July 2012
Die Attach Materials for High Temperature Applications: A Review Manikam, Vemal Raja; Cheong, Kuan Yew IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 1, Issue 4, p. 457-478 https://doi.org/10.1109/TCPMT.2010.2100432	journal	March 2011
Mechanical Properties of Intermetallic Compounds in the Au–Sn System Chromik, R. R.; Wang, D-N.; Shugar, A. Journal of Materials Research, Vol. 20, Issue 8 https://doi.org/10.1557/JMR.2005.0269	journal	August 2005

Similar Records

Superplastic creep of low melting point solder joints

Journal Article · Tue Mar 31 23:00:00 EST 1992 · Journal of Electronic Materials (A.I.M.E. Metallurgical Society); (United States) · OSTI ID:5656892

Superplastic Creep of Eutectic Tin-Lead Solder Joints

Conference · Sat Jun 01 00:00:00 EDT 1991 · Journal of Electronic Packaging · OSTI ID:6229156

Analysis of steady-state creep and creep fracture of directionally solidified eutectic {gamma}/{gamma}{prime}-{alpha} alloy

Journal Article · Tue Aug 01 00:00:00 EDT 1995 · Metallurgical Transactions, A · OSTI ID:109785

Related Subjects

36 MATERIALS SCIENCE
Coarsening
Creep
Grain boundary sliding
Strain rate
Superplasticity

Superplastic creep of AuSn eutectic solder alloy

Citation Formats

References (9)

Similar Records

Related Subjects