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True Breakdown Voltage and Overvoltage Margin of GaN Power HEMTs in Hard Switching

Journal Article · · IEEE Electron Device Letters
 [1];  [2];  [2];  [2];  [3];  [2]
  1. Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, VA (United States); Virginia Polytechnic Institute and State University
  2. Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, VA (United States)
  3. Kyushu University, Fukuoka (Japan)

This work studies the dynamic breakdown voltage (BV) and overvoltage margin of a 650-V-rated commercial GaN power HEMT in hard switching. The dynamic BV measured in the hard switching circuits is over 1.4 kV, being 450 V higher than the static BV measured in the quasi-static I-V sweep. The device can survive at least 1 million hard-switching overvoltage pulses with 1.33 kV peak overvoltage (~95% dynamic BV). Recoverable device parametric shifts are observed after the 1-million pulses, featuring small reductions in threshold voltage and on-resistance. These shifts are different from the ones after the hard-switching pulses without overvoltage and are attributable to the trapping of the holes produced in impact ionization. Furthermore, these results suggest that the BV and overvoltage margin of GaN HEMTs in practical power switching can be significantly underestimated using the static BV. Index Terms— GaN, HEMT, power electronics, hard switching, breakdown voltage, overvoltage, ruggedness, reliability.

Research Organization:
Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, VA (United States)
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Energy Efficiency Office. Advanced Materials & Manufacturing Technologies Office (AMMTO)
Grant/Contract Number:
EE0006521
OSTI ID:
2441248
Journal Information:
IEEE Electron Device Letters, Journal Name: IEEE Electron Device Letters Journal Issue: 4 Vol. 42; ISSN 0741-3106
Publisher:
IEEECopyright Statement
Country of Publication:
United States
Language:
English

References (13)

Relation between UIS withstanding capability and I-V characteristics in high-voltage GaN-HEMTs journal September 2017
Experimental characterization of impact ionization coefficients for electrons and holes in GaN grown on bulk GaN substrates journal June 2018
The 2018 GaN power electronics roadmap journal March 2018
Experimental parametric study of the parasitic inductance influence on MOSFET switching characteristics conference June 2010
A New Approach to Validate GaN FET Reliability to Power-Line Surges Under Use-Conditions conference March 2019
On the impact of carbon-doping on the dynamic Ron and off-state leakage current of 650V GaN power devices conference May 2015
OFF-State Drain-Voltage-Stress-Induced V TH Instability in Schottky-Type p-GaN Gate HEMTs journal June 2021
Dynamic OFF-State Current (Dynamic ${I}_{ \mathrm{\scriptscriptstyle OFF}}$ ) in ${p}$ -GaN Gate HEMTs With an Ohmic Gate Contact journal September 2018
Trap-Mediated Avalanche in Large-Area 1.2 kV Vertical GaN p-n Diodes journal September 2020
Electrothermal Simulation and Thermal Performance Study of GaN Vertical and Lateral Power Transistors journal July 2013
Evidence of Hot-Electron Effects During Hard Switching of AlGaN/GaN HEMTs journal September 2017
Threshold Voltage Instability in p-GaN Gate AlGaN/GaN HFETs journal June 2018
Surge-Energy and Overvoltage Ruggedness of P-Gate GaN HEMTs journal December 2020

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