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Model Validation of a Modular Foam Encapsulated Electronics Assembly With Controlled Preloads Via Additively Manufactured Silicone Lattices

Conference ·
DOI:https://doi.org/10.2172/2431998· OSTI ID:2431998
 [1];  [2];  [3];  [4];  [2];  [2];  [2]
  1. Purdue University
  2. Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
  3. University of North Carolina at Charlotte
  4. Sandia National Laboratories (SNL-CA), Livermore, CA (United States)
+ Show Author Affiliations

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
NA0003525
OSTI ID:
2431998
Report Number(s):
SAND2023-12219C
Country of Publication:
United States
Language:
English

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