Role of humidity and surface roughness on direct wafer bonding

Persson, B. N. J.; Mate, C. Mathew

doi:10.1140/epjb/s10051-024-00680-w

Role of humidity and surface roughness on direct wafer bonding

Journal Article · Wed Apr 17 00:00:00 EDT 2024 · European Physical Journal. B, Condensed Matter and Complex Systems

DOI:https://doi.org/10.1140/epjb/s10051-024-00680-w· OSTI ID:2403639

Persson, B. N. J. ^[1]; Mate, C. Mathew ^[2]

Forschungszentrum Juelich (Germany). Peter Grünberg Institute (PGI-1); Multiscale Consulting, Julich (Germany); SLAC
SLAC National Accelerator Laboratory (SLAC), Menlo Park, CA (United States)

Bodies made from elastically stiff material usually bind very weakly unless the surfaces are flat and extremely smooth. In direct wafer bonding flat surfaces bind by capillary bridges and by the van der Waals interaction, which act between all solid objects. Here we study the dependency of the work of adhesion on the humidity and surface roughness in hydrophilic direct wafer bonding. We show that the long-wavelength roughness (usually denoted waviness) has a negligible influence on the strength of wafer bonding (the work of adhesion) from the menisci that form from capillary condensation of water vapor.

View Accepted Manuscript (DOE)

Research Organization:: SLAC National Accelerator Laboratory (SLAC), Menlo Park, CA (United States)

Sponsoring Organization:: USDOE Office of Science (SC)

Grant/Contract Number:: AC02-76SF00515

OSTI ID:: 2403639

Journal Information:: European Physical Journal. B, Condensed Matter and Complex Systems, Journal Name: European Physical Journal. B, Condensed Matter and Complex Systems Journal Issue: 4 Vol. 97; ISSN 1434-6028

Publisher:: SpringerCopyright Statement

Country of Publication:: United States

Language:: English

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