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Parametric instability of RF discharge with negative ions

Conference ·
OSTI ID:232838
; ;  [1]
  1. Novosibirsk Institute of Theoretical and Applied Mechanics (Russian Federation)
The radio-frequency (RF) discharge is widely used for etching and deposition of semiconductor films. Many gases used in technology are strongly electronegative (f.e. Cl{sub 2}, SF{sub 6}) and ratio of ion (p) and electron (n{sub e}) densities can be very high - up to 100-1000 times. For the typical values of ion density p{approximately}10{sup 11} the ion plasma frequency {var_pi}{sub p} can be close to discharge frequency {omega}{sub 0} = 2{pi}f{approximately}10{sup 8} s{sup -1}. So it is expected that ion-plasma-waves are excited. The intense ion oscillations near plasma-sheath boundary were observed in numerical modelling.
OSTI ID:
232838
Report Number(s):
CONF-950749--
Country of Publication:
United States
Language:
English

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