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Ferroelectric behavior of sputter deposited Al0.72Sc0.28N approaching 5 nm thickness

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/5.0147224· OSTI ID:2311607

Ferroelectric Al1-xScxN has raised much interest in recent years due to its unique ferroelectric properties and complementary metal oxide semiconductor back-end-of-line compatible processing temperatures. Potential applications in embedded nonvolatile memory, however, require ferroelectric materials to switch at relatively low voltages. One approach to achieving a lower switching voltage is to significantly reduce the Al1-xScxN thickness. In this work, ferroelectric behavior in 5-27 nm films of sputter deposited Al0.72Sc0.28N has been studied. We find that the 10 kHz normalized coercive field increases from 4.4 to 7.3 MV/cm when reducing the film thickness from 27.1 to 5.4 nm, while over the same thickness range, the characteristic breakdown field of a 12.5 μm radius capacitor increases from 8.3 to 12.1 MV/cm. In conclusion, the 5.4 nm film demonstrates ferroelectric switching at 5.5 V when excited with a 500 ns pulse and a switching speed of 60 ns.

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA); National Science Foundation (NSF); Semiconductor Research Corporation (SRC)
Grant/Contract Number:
NA0003525
OSTI ID:
2311607
Report Number(s):
SAND--2023-09003J
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 22 Vol. 122; ISSN 0003-6951
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English

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