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Ultrathin Barrier InAlN/GaN Heterostructures for HEMTs

Journal Article · · Semiconductors
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  1. Ioffe Institute (Russian Federation)
  2. Submicron Heterostructures for Microelectronics, Research and Engineering Center, Russian Academy of Sciences (Russian Federation)
  3. Tomsk State University (Russian Federation)

InAlN/AlN/GaN semiconductor heterostructures with a barrier thickness of 5–13 nm have been grown by metalorganic vapor phase epitaxy (MOVPE) on sapphire and SiC substrates. Optimization of GaN buffer and InAlN layers allows fabricating structures with sheet conductivity values below 210 Ohm/sq. High electron mobility transistors (HEMTs) fabricated from such structures show drain current value exceeding 1.25 A/mm with maximum transconductance of 450 mS/mm. Use of thin in situ Si{sub 3}N{sub 4} capping allows to fabricate and compare HEMT and MIS-HEMTs.

OSTI ID:
22945152
Journal Information:
Semiconductors, Journal Name: Semiconductors Journal Issue: 14 Vol. 52; ISSN SMICES; ISSN 1063-7826
Country of Publication:
United States
Language:
English