Cu-7Cr-0.1Ag Microcomposites Optimized for High Strength and High Condutivity
- Nanchang Institute of Technology, Jiangxi Key Laboratory of Precision Drive and Control (China)
- University of Wollongong, Faculty of Engineering and Information Sciences (Australia)
- The University of Queensland, Division of Materials Engineering (Australia)
- Jiangxi Academy of Sciences, Institute of Applied Physics (China)
This paper (i) investigated how the microstructure, conductivity, and mechanical properties of Cu-7Cr-0.1Ag microcomposites were changed by cold drawing and subsequent heat treatment, and (ii) produced the Cu-7Cr-0.1Ag microcomposite with an optimum combination of strength and conductivity. The figure of merit Z (combining strength and conductivity) of the Cu-7Cr-0.1Ag microcomposite was larger than that of the microcomposite without silver for each heat treatment. The value of Z of the Cu-7Cr-0.1Ag microcomposite was a maximum after heat treatment for 1 h at 600 °C, indicating that this was the optimum intermediate heat treatment. The following combinations of conductivity, strength and ductility (measured as elongation to fracture) were obtained by the Cu-7Cr-0.1Ag microcomposite with η = 8: (i) 77.9% IACS (International Annealed Copper Standard), 920 MPa and 3.1%; (ii) 79.3% IACS, 880 MPa and 3.3%; and (iii) 79.9% IACS, 798 MPa and 3.5%. These values for the Cu-7Cr-0.1Ag microcomposite were larger than those of the Cu-7Cr microcomposite.
- OSTI ID:
- 22858023
- Journal Information:
- Journal of Materials Engineering and Performance, Journal Name: Journal of Materials Engineering and Performance Journal Issue: 3 Vol. 27; ISSN 1059-9495; ISSN JMEPEG
- Country of Publication:
- United States
- Language:
- English
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