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Development of a high strength, high conductivity copper-silver alloy for pulsed magnets

Conference · · IEEE Transactions on Magnetics (Institute of Electrical and Electronics Engineers); (United States)
OSTI ID:5363670
; ; ;  [1]
  1. Superconducting and Cryogenic Materials Div., Tsukuba Lab., National Research Inst. for Metals, 1-2-1, Sengen, Tsukuba, Ibaraki 305 (JP)

Development of highly conductive materials with high strength is requisite for conductors of high-field magnets. To develop such materials, the Cu-Ag alloys (2-60 at%) and their fabrication methods have been investigated. The Cu-Ag alloys were prepared by melting electrolytic Cu and pure Ag pellets in an argon atmosphere, and then cold-drawn to a 99.2% reduction in area. The heat treatments were performed several times during the drawing process. Strength and conductivity of the Cu-Ag alloys vary with thermomechanical treatments. The optimum combination of high strength and high electrical conductivity were obtained by cold-drawing the alloy with intermediate heat treatments at 350-450{degrees}C for 1-2h. The intermediate-heat-treated Cu-16 at%Ag composite with 99% reduction in area had an ultimate tensile strength of 1000 MPa and an electrical conductivity of 80 IACS% at room temperature. This paper reports that since the Cu-Ag alloys fabricated by the present method have higher values of both tensile strength and conductivity than those of Cu-Nb and other Cu-based alloys, they would be one of the most promising conductor materials for the high field magnets.

OSTI ID:
5363670
Report Number(s):
CONF-910662--
Journal Information:
IEEE Transactions on Magnetics (Institute of Electrical and Electronics Engineers); (United States), Journal Name: IEEE Transactions on Magnetics (Institute of Electrical and Electronics Engineers); (United States) Vol. 28:1; ISSN IEMGA; ISSN 0018-9464
Country of Publication:
United States
Language:
English