Mitigation of tin whisker growth by inserting Ni nanocones

Journal Article · Fri Dec 15 04:00:00 EST 2017 · Materials Characterization

DOI:https://doi.org/10.1016/J.MATCHAR.2017.11.002· OSTI ID:22804830

Sun, Menglong; Long, Xiaoping; Dong, Mengya; Xia, Yuanyuan; Hu, Fengtian; Hu, An-min; Li, Ming ^[1]

---

1. State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240 (China)

Highlights: • Tin whisker growth is mitigated effectively by inserting Ni nanocones. • Ni nanocones impede Sn dynamic recrystallization by blocking dislocation motions. • The inhibition method and mechanism are important to the study of tin whisker. - Abstract: An innovative controllable way has been proposed to mitigate tin whisker growth by inserting Ni nanocones prepared by electrodeposition. The results reveal that, after inserting Ni nanocones, tin whisker formation is mitigated effectively for 1.6 μm Sn coating but there is no inhibition effect for 4.5 μm Sn coating. The coatings are characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectrometer and electron backscatter diffraction (EBSD). The EBSD results show that Sn grain size without Ni nanocones increases significantly after indentation test compared with Sn grains with Ni nanocones. The inhibition effect of Ni nanocones on whisker growth can be ascribed to its specific structure which prevents dynamic recrystallization and produces horizontal grain boundaries of Sn grains. The structural inhibition method and mechanism proposed are of great importance to the research of tin whisker.

• OSTI ID: 22804830
• Journal Information: Materials Characterization, Journal Name: Materials Characterization Vol. 134; ISSN 1044-5803; ISSN MACHEX
• Country of Publication: United States
• Language: English

Related Subjects

77 NANOSCIENCE AND NANOTECHNOLOGY
BACKSCATTERING
COATINGS
COMPARATIVE EVALUATIONS
DISLOCATIONS
ELECTRODEPOSITION
ELECTRON DIFFRACTION
GRAIN BOUNDARIES
GRAIN SIZE
RECRYSTALLIZATION
SCANNING ELECTRON MICROSCOPY
TIN
WHISKERS
X-RAY DIFFRACTION