Influence of current density on microstructure of pulse electrodeposited tin coatings

Journal Article · Fri Jun 15 04:00:00 EDT 2012 · Materials Characterization

DOI:https://doi.org/10.1016/J.MATCHAR.2012.03.002· OSTI ID:22066452

Sharma, Ashutosh; Bhattacharya, Sumit; Sen, Ranjan; Reddy, B S.B. ^[1]; Fecht, H -J ^[2]; Das, Karabi ^[1]; Das, Siddhartha ^[1]

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1. Department of Metallurgical and Materials Engineering, Indian Institute of Technology-Kharagpur, Kharagpur-721302 (India)
2. Institut fuer Mikro- und Nanomaterialien, Universitaet Ulm, D-89081 Ulm (Germany)

Pulse electrodeposited tin coatings on copper substrate have been synthesized from an aqueous solution containing sodium stannate (Na{sub 2}SnO{sub 3}.3H{sub 2}O) and sodium hydroxide (NaOH). The effect of current density on surface morphology of the deposits has been investigated. As deposited coatings are characterized by X-ray diffraction, scanning electron microscopy, electron backscatter diffraction, and line profile analysis. The X-ray diffraction analysis shows that the deposits consist of tetragonal ({beta}-Sn) structure with microcrystalline grains. The deposits plated at lower current density exhibit (110) texture which decreases with increasing current densities. The effects of current density on Cu-Sn diffusion and whisker growth of the electrodeposited tin coatings are also reported here. - Highlights: Black-Right-Pointing-Pointer Pulse electrodeposition of Sn from aqueous alkaline solution without adding any organic additive. Black-Right-Pointing-Pointer Effect of current density on morphology and whisker growth in tin coatings aged for 1 year. Black-Right-Pointing-Pointer Solution bath is stable and can be operated over a wide range of current density.

• OSTI ID: 22066452
• Journal Information: Materials Characterization, Journal Name: Materials Characterization Journal Issue: Complete Vol. 68; ISSN 1044-5803; ISSN MACHEX
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
AQUEOUS SOLUTIONS
COATINGS
COPPER
CRYSTAL GROWTH
CURRENT DENSITY
DIFFUSION
ELECTRODEPOSITION
MICROSTRUCTURE
MORPHOLOGY
PULSES
SCANNING ELECTRON MICROSCOPY
SODIUM HYDROXIDES
SUBSTRATES
TETRAGONAL LATTICES
TEXTURE
TIN
X-RAY DIFFRACTION