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1 kV Self-Aligned Vertical GaN Superjunction Diode

Journal Article · · IEEE Electron Device Letters
 [1];  [1];  [1];  [2];  [3];  [1];  [1];  [4];  [4];  [4];  [5];  [6];  [7];  [1]
  1. Virginia Polytechnic Inst. and State Univ. (Virginia Tech), Blacksburg, VA (United States)
  2. Virginia Polytechnic Inst. and State Univ. (Virginia Tech), Blacksburg, VA (United States); Naval Research Lab. (NRL), Washington, DC (United States)
  3. Univ. of Southern California, Los Angeles, CA (United States)
  4. Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
  5. Univ. of Cambridge (United Kingdom)
  6. Naval Research Lab. (NRL), Washington, DC (United States)
  7. Univ. of Hong Kong, (Hong Kong)
This work demonstrates vertical GaN superjunction (SJ) diodes fabricated via a novel self-aligned process. The SJ comprises n-GaN pillars wrapped by the charge-balanced p-type nickel oxide (NiO). After the NiO sputtering around GaN pillars, the self-aligned process exposes the top pillar surfaces without the need for additional lithography or a patterned NiO etching which is usually difficult. The GaN SJ diode shows a breakdown voltage (B V) of 1100 V, a specific on-resistance (RON) of 0.4 mΩ· cm2, and a SJ drift-region resistance ( Rdr) of 0.13 mΩ· cm2. Further, the device also exhibits good thermal stability with B V retained over 1 kV and RON dropped to 0.3 mΩ· cm2 at 125°C. The trade-off between B V and Rdr is superior to the 1D GaN limit. These results show the promise of vertical GaN SJ power devices. The self-aligned process is applicable for fabricating the heterogeneous SJ based on various wide- and ultra-wide bandgap semiconductors.
Research Organization:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). Center for Nanophase Materials Sciences (CNMS)
Sponsoring Organization:
National Science Foundation (NSF); US Department of the Navy, Office of Naval Research (ONR); USDOE Office of Science (SC), Basic Energy Sciences (BES)
Grant/Contract Number:
AC05-00OR22725
OSTI ID:
2278907
Journal Information:
IEEE Electron Device Letters, Journal Name: IEEE Electron Device Letters Journal Issue: 1 Vol. 45; ISSN 0741-3106
Publisher:
IEEECopyright Statement
Country of Publication:
United States
Language:
English

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