Filling and solidification with coupled heat transfer and stress analysis
Conference
·
OSTI ID:227832
- Ove Arup and Partners, London (United Kingdom)
- Applied Computing and Engineering Ltd., Birchwood (United Kingdom). Genesis Centre
A full filling and solidification simulation of the MCWASP 7 casting has been carried out using the commercial finite element (FE) analysis codes LS-DYNA3D and FIDAP. The two codes were used to carry out back-to-back analysis of the mould filling. Both codes track the free surface and predict filling times. LS-DYNA3D has been used both for the filling simulation and to carry out a coupled thermal and stress analysis of the casting during solidification, predicting cooling rates, residual stresses and as-cast shape. The methodology used and details of the FE models are summarized. Results are presented for comparison with the casting trial data (x-rays of filling and thermocouple data).
- OSTI ID:
- 227832
- Report Number(s):
- CONF-9509118--; ISBN 0-87339-297-3
- Country of Publication:
- United States
- Language:
- English
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