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Structural properties of Bi{sub 2}Te{sub 3} topological insulator thin films grown by molecular beam epitaxy on (111) BaF{sub 2} substrates

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.4947266· OSTI ID:22594659
;  [1];  [2]
  1. LAS, Instituto Nacional de Pesquisas Espaciais, CP 515, 12245-970 São José dos Campos, SP (Brazil)
  2. Instituto de Física, Universidade de São Paulo, CP 66318, 05315-970 São Paulo, SP (Brazil)
Structural properties of topological insulator bismuth telluride films grown epitaxially on (111) BaF{sub 2} with a fixed Bi{sub 2}Te{sub 3} beam flux were systematically investigated as a function of substrate temperature and additional Te flux. A layer-by-layer growth mode is observed since the early stages of epitaxy and remains throughout the whole deposition. Composition of the epitaxial films produced here stays between Bi{sub 2}Te{sub 3} and Bi{sub 4}Te{sub 5}, as determined from the comparison of the measured x-ray diffraction curves with calculations. The substrate temperature region, where the growth rate remains constant, is found to be the most appropriate to obtain ordered Bi{sub 2}Te{sub 3} films. Line width of the L = 18 Bi{sub 2}Te{sub 3} diffraction peaks as low as 140 arcsec was obtained, indicating high crystalline quality. Twinning domains density rises with increasing growth temperature and reducing Te extra flux. X-ray reflectivity curves of pure Bi{sub 2}Te{sub 3} films with thickness from 165 to 8 nm exhibited well defined interference fringes, evidencing homogeneous layers with smooth surface. Our results demonstrate that Bi{sub 2}Te{sub 3} films with very well controlled structural parameters can be obtained. High structural quality Bi{sub 2}Te{sub 3} films as thin as only eight quintuple layers grown here are promising candidates for intrinsic topological insulator.
OSTI ID:
22594659
Journal Information:
Journal of Applied Physics, Journal Name: Journal of Applied Physics Journal Issue: 16 Vol. 119; ISSN JAPIAU; ISSN 0021-8979
Country of Publication:
United States
Language:
English