Silver-containing polymer composition used in spacecraft and semiconductor optoelectronics control systems

Journal Article · Tue Oct 27 00:00:00 EDT 2015 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.4932764· OSTI ID:22492532

Ivanov, A. A., E-mail: [e-mail]; Tuev, V. I., E-mail: [e-mail] ^[1]

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1. Tomsk State University of Control Systems and Radioelectronics, Tomsk, 634050 (Russian Federation)

The copolymer of the vinyl chloride-maleic anhydride and silver nano- and microparticle (70 wt %) composition is offered as a conductive adhesive for fixing various chips on the dielectric substrate. The wiring volume resistivity is up to 3.1×10{sup −8} Ohm×m. The adhesive strength of the silver-containing polymer composition (70% of Ag) applied under a shear on the dielectric substrate is 106 N/mm{sup 2}. Adhesive layers obtained from these substances have a high thermal conductivity up to λ = 199.93 W/m×K that depends on the amount of Ag in the polymer composition.

• OSTI ID: 22492532
• Journal Information: AIP Conference Proceedings, Vol. 1683, Issue 1; Conference: International conference on advanced materials with hierarchical structure for new technologies and reliable structures 2015, Tomsk (Russian Federation), 21-25 Sep 2015; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
42 ENGINEERING
ADHESIVES
ANHYDRIDES
CONTROL SYSTEMS
COPOLYMERS
DIELECTRIC MATERIALS
LAYERS
OPTOELECTRONIC DEVICES
SEMICONDUCTOR MATERIALS
SHEAR
SILVER
SPACE VEHICLES
SUBSTRATES
THERMAL CONDUCTIVITY
VINYL CHLORIDE
WIRES