Dislocation density of pure copper processed by accumulative roll bonding and equal-channel angular pressing

Journal Article · Mon Jun 15 00:00:00 EDT 2015 · Materials Characterization

DOI:https://doi.org/10.1016/J.MATCHAR.2015.04.009· OSTI ID:22476100

Miyajima, Yoji ^[1]; Okubo, Satoshi; Abe, Hiroki; Okumura, Hiroki ^[1]; Fujii, Toshiyuki ^[2]; Onaka, Susumu; Kato, Masaharu ^[1]

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1. Department of Materials Science and Engineering, Graduate School of Science and Engineering, Tokyo Institute of Technology, 4259-J2-63, Nagatsuta-cho, Midori-ku, Yokohama 226-8502 (Japan)
2. Department of Metallurgy and Ceramics Science, Graduate School of Engineering, Tokyo Institute of Technology, 2-12-1-S8-7, Ookayama, Meguro-ku, Tokyo 152-8552 (Japan)

The dislocation density of pure copper fabricated by two severe plastic deformation (SPD) processes, i.e., accumulative roll bonding and equal-channel angular pressing, was evaluated using scanning transmission electron microscopy/transmission electron microscopy observations. The dislocation density drastically increased from ~ 10{sup 13} m{sup −} {sup 2} to about 5 × 10{sup 14} m{sup −} {sup 2}, and then saturated, for both SPD processes.

• OSTI ID: 22476100
• Journal Information: Materials Characterization, Vol. 104; Other Information: Copyright (c) 2015 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA); ISSN 1044-5803
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
BONDING
COPPER
DENSITY
DISLOCATIONS
GRAIN SIZE
PLASTICITY
TRANSMISSION ELECTRON MICROSCOPY