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Heat flux micro coolers having multi-stepped features and fluid wicking

Patent ·
OSTI ID:2222149

A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.

Research Organization:
National Renewable Energy Laboratory (NREL), Golden, CO (United States); Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (United States); Stanford Univ., CA (United States); Univ. of California, Merced, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC36-08GO28308
Assignee:
Toyota Motor Engineering & Manufacturing North America, Inc. (Plano, TX); The Board of Trustees of the Leland Stanford Junior University (Stanford, CA); The Regents of the University of California, Merced (Merced, CA); Alliance for Sustainable Energy, LLC (Golden, CO)
Patent Number(s):
11,729,951
Application Number:
17/575,071
OSTI ID:
2222149
Country of Publication:
United States
Language:
English

References (1)

Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance journal March 2019

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