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Title: Indirect evaporative coolers with enhanced heat transfer

Abstract

A separator plate assembly for use in an indirect evaporative cooler (IEC) with an air-to-air heat exchanger. The assembly includes a separator plate with a first surface defining a dry channel and a second surface defining a wet channel. The assembly includes heat transfer enhancements provided on the first surface for increasing heat transfer rates. The heat transfer enhancements may include slit fins with bodies extending outward from the first surface of separator plate or may take other forms including vortex generators, offset strip fins, and wavy fins. In slit fin implementations, the separator plate has holes proximate to each of the slit fins, and the separator plate assembly may include a sealing layer applied to the second surface of the separator plate to block air flow through the holes. The sealing layer can be a thickness of adhesive, and a layer of wicking material is applied to the adhesive.

Inventors:
; ;
Publication Date:
Research Org.:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1215829
Patent Number(s):
9,140,471
Application Number:
13/801,395
Assignee:
Alliance For Sustainable Energy, LLC (Golden, CO)
DOE Contract Number:  
AC36-08GO28308
Resource Type:
Patent
Resource Relation:
Patent File Date: 2013 Mar 13
Country of Publication:
United States
Language:
English
Subject:
32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION

Citation Formats

Kozubal, Eric, Woods, Jason, and Judkoff, Ron. Indirect evaporative coolers with enhanced heat transfer. United States: N. p., 2015. Web.
Kozubal, Eric, Woods, Jason, & Judkoff, Ron. Indirect evaporative coolers with enhanced heat transfer. United States.
Kozubal, Eric, Woods, Jason, and Judkoff, Ron. 2015. "Indirect evaporative coolers with enhanced heat transfer". United States. https://www.osti.gov/servlets/purl/1215829.
@article{osti_1215829,
title = {Indirect evaporative coolers with enhanced heat transfer},
author = {Kozubal, Eric and Woods, Jason and Judkoff, Ron},
abstractNote = {A separator plate assembly for use in an indirect evaporative cooler (IEC) with an air-to-air heat exchanger. The assembly includes a separator plate with a first surface defining a dry channel and a second surface defining a wet channel. The assembly includes heat transfer enhancements provided on the first surface for increasing heat transfer rates. The heat transfer enhancements may include slit fins with bodies extending outward from the first surface of separator plate or may take other forms including vortex generators, offset strip fins, and wavy fins. In slit fin implementations, the separator plate has holes proximate to each of the slit fins, and the separator plate assembly may include a sealing layer applied to the second surface of the separator plate to block air flow through the holes. The sealing layer can be a thickness of adhesive, and a layer of wicking material is applied to the adhesive.},
doi = {},
url = {https://www.osti.gov/biblio/1215829}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Sep 22 00:00:00 EDT 2015},
month = {Tue Sep 22 00:00:00 EDT 2015}
}

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