Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Arsenic redistribution after solid phase epitaxial regrowth of shallow pre-amorphized silicon layers

Journal Article · · AIP Conference Proceedings
DOI:https://doi.org/10.1063/1.4766541· OSTI ID:22075709
; ; ; ; ; ; ;  [1]
  1. CMM, Fondazione Bruno Kessler, Via Sommarive 18. 38123 Povo - Trento (Italy)
The behavior of ultra shallow ion implants of arsenic in Si following solid phase epitaxial re-growth process is reported. A 16 nm amorphous layer was created by ion implantation of Si{sup +} at energy 5 keV and a dose 1 Multiplication-Sign 10{sup 15} at/cm{sup 2}. As ion were implanted at 2 keV using 3 different doses: 1 Multiplication-Sign 10{sup 14}, 5 Multiplication-Sign 10{sup 14} and 1 Multiplication-Sign 10{sup 15} at/cm{sup 2}. The resulting As distributions, confined in the amorphous layer, were thermally treated at 550 Degree-Sign C for 5-300 s in order to electrically activate dopant atoms. Crystal re-growth and As redistribution was investigated by secondary ion mass spectrometry and medium energy ion scattering. A growth rate depending on the As concentration was observed, the rate being slower for higher As content. Arsenic re-distribution to the surface and at the end-of-range defects was observed and a segregation model was developed. Finally, the substitutional fraction of As atoms was related to sheet resistance measurements revealing a higher fraction of electrically active dopant atoms in pre-amorphized samples compared to not pre-amorphized.
OSTI ID:
22075709
Journal Information:
AIP Conference Proceedings, Journal Name: AIP Conference Proceedings Journal Issue: 1 Vol. 1496; ISSN APCPCS; ISSN 0094-243X
Country of Publication:
United States
Language:
English