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Title: Impact of Morphological Features on the Dielectric Breakdown at SiO{sub 2}/3C-SiC Interfaces

Journal Article · · AIP Conference Proceedings
DOI:https://doi.org/10.1063/1.3518308· OSTI ID:21428738
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  1. CNR-IMM, Strada VIII n. 5, Zona Industriale, 95121, Catania (Italy)
  2. LMI, UMR-CNRS 5615, UCB-Lyon1, 43 Bd du 11 nov. 1918, 69622 Villeurbanne (France)

Thin SiO{sub 2} layers were thermally grown onto cubic silicon carbide (3C-SiC) heteroepitaxial layers of different surface roughness and with different types of near-surface epitaxial defects. Localized dielectric breakdown (BD) was studied by electrically stressing the system using Conductive Atomic Force Microscopy (C-AFM), which constitutes a means to directly and simultaneously observe localized dielectric failure as a function of stress time and surface morphology with nanoscale lateral resolution. The BD kinetics was evaluated by fitting the experimental failure ratios as a function of stress time to the failure probability described by Weibull statistics, in turn allowing to distinguish between defect-induced (extrinsic) and intrinsic dielectric BD events. The results give useful information about how morphological features at the 3C-SiC surface influence the BD generation in thermally grown oxides on this polytype.

OSTI ID:
21428738
Journal Information:
AIP Conference Proceedings, Vol. 1292, Issue 1; Conference: E-MRS Symposium F: 2010 wide bandgap cubic semiconductors - From growth to devices, Strasbourg (France), 8-10 Oct 2010; Other Information: DOI: 10.1063/1.3518308; (c) 2010 American Institute of Physics; ISSN 0094-243X
Country of Publication:
United States
Language:
English