Instrumentation for Microfabrication with Deep X-ray Lithography
- Forschungszentrum Karlsruhe GmbH, Institut fuer Mikrostrukturtechnik, Postfach 3640, D- 76021 Karlsruhe (Germany)
Deep X-ray lithography for microfabrication is performed at least at ten synchrotron radiation centers worldwide. The characteristic energies of these sources range from 1.4 keV up to 8 keV, covering mask making capabilities, deep X-ray lithography up to ultra deep x-ray lithography of several millimeters resist thickness. Limitations in deep X-ray lithography arise from hard X-rays in the SR-spectrum leading to adhesion losses of resist lines after the developing process, as well as heat load due to very high fluxes leading to thermal expansion of mask and resist during exposure and therefore to microstructure distortion. Considering the installations at ANKA as an example, the advantages of mirrors and central beam stops for DXRL are presented. Future research work will concentrate on feature sizes much below 1 {mu}m, while the commercialization of DXRL goes in the direction of massive automation, including parallel exposures of several samples in a very wide SR-fan, developing and inspection.
- OSTI ID:
- 21049300
- Journal Information:
- AIP Conference Proceedings, Vol. 879, Issue 1; Conference: 9. international conference on synchrotron radiation instrumentation, Daegu (Korea, Republic of), 28 May - 2 Jun 2006; Other Information: DOI: 10.1063/1.2436339; (c) 2007 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
- Country of Publication:
- United States
- Language:
- English
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