Characteristics of Ti-Ni-Pd shape memory alloy thin films

Journal Article · Tue Nov 15 04:00:00 EST 2005 · Materials Characterization

DOI:https://doi.org/10.1016/j.matchar.2005.07.002· OSTI ID:20833173

Congchun, Zhang ^[1]; Chunsheng, Yang ^[1]; Duifu, Ding ^[1]; Shiqiang, Qian ^[2]; Jiansheng, Wu ^[2]

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1. Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University (China)
2. School of Material Science and Engineering, Shanghai Jiaotong University, 200030, Shanghai (China)

Ti-Ni-Pd thin films were deposited by RF magnetron sputtering. Microstructure and phase transformation behaviors were studied by X-ray diffraction (XRD), by transmission electron microscopy and by differential scanning calorimeter (DSC). Also tensile tests and the internal friction characteristics were examined. Annealing at 750 deg. C followed by subsequent annealing at 450 deg. C resulted in relatively homogeneous microstructure and uniform martensite/austenite transformation. The results from DSC showed clearly the martensitic transformation upon heating and cooling, the transformation temperatures are 112 deg. C (M* peak) and 91 deg. C (M peak), respectively. The transformation characteristics are also found in strain-temperature curves and internal friction-temperature curves. The film had shape memory effect. The frequency had no effect on the modulus, but the internal friction decreased with increasing frequency.

• OSTI ID: 20833173
• Journal Information: Materials Characterization, Journal Name: Materials Characterization Journal Issue: 4-5 Vol. 55; ISSN 1044-5803; ISSN MACHEX
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ANNEALING
AUSTENITE
CALORIMETRY
DEPOSITION
INTERNAL FRICTION
MAGNETRONS
MARTENSITE
MICROSTRUCTURE
NICKEL ALLOYS
PALLADIUM ALLOYS
PHASE TRANSFORMATIONS
SHAPE MEMORY EFFECT
SPUTTERING
THIN FILMS
TRANSMISSION ELECTRON MICROSCOPY
X-RAY DIFFRACTION