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Title: Growth dynamics of reactive-sputtering-deposited AlN films

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.1937467· OSTI ID:20711756
; ; ; ; ;  [1]
  1. Instituto de Ciencia de Materiales de Madrid-Consejo Superior de Investigaciones Cientificas CSIC, C-Sor Juana Ines de la Cruz 3, E-28049, Cantoblanco, Madrid (Spain)

We have studied the surface kinetic roughening of AlN films grown on Si(100) substrates by dc reactive sputtering within the framework of the dynamic scaling theory. Films deposited under the same experimental conditions for different growth times were analyzed by atomic force microscopy and x-ray diffraction. The AlN films display a (002) preferred orientation. We have found two growth regimes with a crossover time of 36 min. In the first regime, the growth dynamics is unstable and the films present two types of textured domains, well textured and randomly oriented, respectively. In contrast, in the second regime the films are homogeneous and well textured, leading to a relative stabilization of the surface roughness characterized by a growth exponent {beta}=0.37{+-}0.03. In this regime a superrough scaling behavior is found with the following exponents: (i) Global exponents: roughness exponent {alpha}=1.2{+-}0.2 and {beta}=0.37{+-}0.03 and coarsening exponent 1/z=0.32{+-}0.05; (ii) local exponents: {alpha}{sub loc}=1, {beta}{sub loc}=0.32{+-}0.01. The differences between the growth modes are found to be related to the different main growth mechanisms dominating their growth dynamics: sticking anisotropy and shadowing, respectively.

OSTI ID:
20711756
Journal Information:
Journal of Applied Physics, Vol. 97, Issue 12; Other Information: DOI: 10.1063/1.1937467; (c) 2005 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
Country of Publication:
United States
Language:
English

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