Strain relaxation of GeSi/Si(001) heterostructures grown by low-temperature molecular-beam epitaxy

Journal Article · Wed Dec 15 00:00:00 EST 2004 · Journal of Applied Physics

DOI:https://doi.org/10.1063/1.1809772· OSTI ID:20662236

Bolkhovityanov, Yu B; Deryabin, A S; Gutakovskii, A K; Revenko, M A; Sokolov, L V ^[1]

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1. Institute of Semiconductor Physics, Novosibirsk 630090 (Russian Federation)

Plastic relaxation in Ge{sub x}Si{sub 1-x}/Si(001) heterostructures with x=0.18-0.62, grown at temperatures of 300-600 degree sign C with the use of a low-temperature (350 deg. C) Si buffer layer, is considered. It is shown that the use of low-temperature Si and low temperature of growth of GeSi films decreases the density of threading dislocations to the value of 10{sup 5}-10{sup 6} cm{sup -2} in heterostructures with a germanium content x<(bar sign)0.3, whereas the density of the threading dislocations in heterostructures with a higher content of Ge remains at the level of {approx}10{sup 8} cm{sup -2} and higher. By means of transmission electron microscopy, it is shown that the origination of dislocation half-loops from the surface in the case of a high content of germanium in the film is the main reason for the high density of threading dislocations. Growing of GeSi films with a two-step change in composition is considered. The fact that the density of the threading dislocations in the first step of the film is significantly higher than that in the substrate is noted. Because of their presence, the real thickness of insertion of misfit dislocations into the second step of the film is in ten times less than for the first layer. With an allowance for this effect, almost complete plastic relaxation of the second and further heterostructure steps can be reached at low temperatures and at a smaller thickness of GeSi films. It is concluded that the main factors of low-temperature epitaxy of GeSi, which reduce the density of the threading dislocations in heterostructures are (i) a decrease in the initial threading dislocation density and (ii) an increase in the rate of expansion of dislocation loops, which facilitates plastic relaxation with a smaller number of threading dislocations.

• OSTI ID: 20662236
• Journal Information: Journal of Applied Physics, Vol. 96, Issue 12; Other Information: DOI: 10.1063/1.1809772; (c) 2004 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
DISLOCATIONS
EXPANSION
FILMS
GERMANIUM
GERMANIUM ALLOYS
HETEROJUNCTIONS
LAYERS
MOLECULAR BEAM EPITAXY
PLASTICITY
SEMICONDUCTOR MATERIALS
SILICON
SILICON ALLOYS
STRAINS
STRESS RELAXATION
SUBSTRATES
SURFACES
TEMPERATURE DEPENDENCE
TEMPERATURE RANGE 0400-1000 K
THICKNESS
TRANSMISSION ELECTRON MICROSCOPY