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Grain boundary hardening and triple junction hardening in polycrystalline molybdenum

Journal Article · · Acta Materialia
 [1];  [1];  [1]
  1. Laboratory of Materials Design and Interface Engineering, Department of Nanomechanics, Graduate School of Engineering, Tohoku University, Aramaki-Aza-Aoba 6-6-01, Aoba-Ku, Sendai 980-8579 (Japan)

The grain boundary and triple junction hardenings in molybdenum with different carbon content were studied in connection with the character and the connectivity of grain boundaries at triple junctions by the micro-indentation test. The triple junction hardening is smaller at the junctions composed of low-angle and {sigma} boundaries than at the junctions composed of random boundaries. This difference in the hardening depending on the grain boundary connectivity becomes more significant with a decrease in carbon content in molybdenum.

OSTI ID:
20637153
Journal Information:
Acta Materialia, Journal Name: Acta Materialia Journal Issue: 4 Vol. 53; ISSN 1359-6454; ISSN ACMAFD
Country of Publication:
United States
Language:
English

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