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Computer simulation study of grain boundary and triple junction distributions in microstructures formed by multiple twinning

Journal Article · · Acta Metallurgica et Materialia
 [1];  [1]
  1. Univ. of Manitoba, Winnipeg, Manitoba (Canada)

Microstructures formed as a result of multiple twinning have been simulated by means of computer modeling. Grain boundary misorientation (character) and triple junction distributions have been studied with the emphasis on the effect of initial texture and multiple twinning process. Although grain boundary distributions are similar in all the microstructures modeled, sharp initial texture leads to a somewhat enhanced amount of {Sigma}3 boundaries and to a considerable increase in the number of triple junctions containing two {Sigma}3 boundaries. The impact of these parameters on the material susceptibility to intergranular crack propagation has been analyzed and implications for grain boundary engineering has been discussed.

OSTI ID:
72442
Journal Information:
Acta Metallurgica et Materialia, Journal Name: Acta Metallurgica et Materialia Journal Issue: 6 Vol. 43; ISSN 0956-7151; ISSN AMATEB
Country of Publication:
United States
Language:
English

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