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{tau} phase formation in a TiC + TiB{sub 2} composite bonded with a nickel based binder alloy

Journal Article · · Scripta Materialia

Densification and ductility has been achieved in a TiC + TiB{sub 2} cermet prepared by pressureless sintering using a nickel based binder with an additive, based on their proposed empirical model. In the context of bonding in the binary, Holleck et al have suggested that the structures of TiC and TiB{sub 2} allows coherence to be established between their most densely packed lattice planes. This favorable interfacial match in the TiC + TiB{sub 2} composite is assumed to encourage a high mobility of atoms across the interface, leading to densification during sintering. The fracture toughness of a TiC + TiB{sub 2} composite would also be expected to improve when good interfacial coherence exists between TiC and TiB{sub 2}. In the case of their preferred nickel-based binder, one of the reasons for selecting the additive is to prevent the formation o deleterious grain boundary phases like the {tau} phase which often forms in Ni-TiB{sub 2} systems, with the expectation that if new phases do form they would be soluble in a TiC + TiB{sub 2} matrix. Previous attempts to find suitable sintering additives for TiB{sub 2} revealed that Fe, Co and Ni binders reacted with the TiB{sub 2} at the sintering temperatures forming secondary borides of the type M{sub 2}B. The formation of these undesirable (secondary) borides has been identified to be linked to either the presence of contaminants like oxygen, carbon and nitrogen which react with Ti, leaving behind free boron for reaction with the selected metallic binder, or, a direct reaction between the metal binder and TiB{sub 2}.

Research Organization:
Manchester Univ. (GB)
OSTI ID:
20023098
Journal Information:
Scripta Materialia, Journal Name: Scripta Materialia Journal Issue: 12 Vol. 40; ISSN 1359-6462; ISSN SCMAF7
Country of Publication:
United States
Language:
English

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