Microstructure, mechanical properties, and thermoelectric properties of hot-extruded p-type Te-doped Bi{sub 0.5}Sb{sub 1.5}Te{sub 3} compounds

Conference · Tue Jul 01 04:00:00 EDT 1997

OSTI ID:20014251

Park, K; Seo, J; Lee, C

The p-type Bi{sub 0.5}Sb{sub 1.5}Te{sub 3} compounds with Te dopant (4.0 and 6.0 wt%) and without dopant were fabricated by hot extrusion in the temperature range of 300 to 510 C under an extrusion ratio of 20:1. The undoped and Te doped compounds were highly dense and showed high crystalline quality. The grains contained many dislocations and were fine equiaxed ({approximately}1.0 {micro}m) owing to the dynamic recrystallization during the extrusion. The hot extrusion gave rise to the preferred orientation of grains. The bending strength and the figure of merit of the undoped and Te doped compounds were increased with increasing the extrusion temperature. The Te dopant significantly increased the figure of merit. The values of the figure of merit of the undoped and 4.0 wt% Te-doped compounds hot extruded at 440 C were 2.11 x 10{sup {minus}3}/K and 2.94 x 10{sup {minus}3}/K, respectively.

• Research Organization: Chung-ju National Univ., Chungbuk (KR)
• Sponsoring Organization: Korea Ministry of Information and Communication
• OSTI ID: 20014251
• Country of Publication: United States
• Language: English

Related Subjects

30 DIRECT ENERGY CONVERSION
36 MATERIALS SCIENCE
ANTIMONY TELLURIDES
BISMUTH TELLURIDES
DOPED MATERIALS
EXPERIMENTAL DATA
MECHANICAL PROPERTIES
MICROSTRUCTURE
SEMICONDUCTOR MATERIALS
TEMPERATURE DEPENDENCE
THERMOELECTRIC MATERIALS
THERMOELECTRIC PROPERTIES