Nanoindentation-induced defect-interface interactions: Phenomena, methods and limitations
Nanoindentation for measuring thin film mechanical properties is probably the most popular yet ill-understood method due to its inherent complexities. As opposed to burst pressure or microtensile tests of lithographed structures, where relatively uniform stress fields may be generated, the indentation-induced stress gradients can produce unique challenges. Because of the test's simplicity and ability to mechanically probe the smallest of scales, it is becoming increasingly applied. Five possible stages of deformation are suggested from Hertzian elastic to film delamination and double buckling. In particular metal films on harder substrates are emphasized where it is shown that dislocation nucleation and arrest are only partially understood. Later stages of film delamination are illustrated with Cu/SiO{sub 2}/Si where it is shown that the true work of adhesion is 0.6 J/m{sup 2}. Current limitations of indentation-induced delamination measures of toughness involve large scatter associated with sensitivity of the fracture radius to the contact radius ratio.
- Research Organization:
- Univ. of Minnesota, Minneapolis, MN (US)
- Sponsoring Organization:
- Office of Naval Research; US Department of Energy; National Science Foundation
- DOE Contract Number:
- FG02-96ER45574; FG02-85ER13433
- OSTI ID:
- 20005387
- Journal Information:
- Acta Materialia, Journal Name: Acta Materialia Journal Issue: 15-16 Vol. 47; ISSN 1359-6454; ISSN ACMAFD
- Country of Publication:
- United States
- Language:
- English
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