Hyperelastic binder for printed, stretchable electronics

Wang, Joseph; Kumar, Rajan; Meng, Ying Shirley; Shin, Jae Wook; Yin, Lu

Title: Hyperelastic binder for printed, stretchable electronics

Patent · Tue Jun 13 00:00:00 EDT 2023

OSTI ID:1998492

Wang, Joseph; Kumar, Rajan; Meng, Ying Shirley; Shin, Jae Wook; Yin, Lu

Disclosed are compositions, devices, systems and fabrication methods for stretchable composite materials and stretchable electronics devices. In some aspects, an elastic composite material for a stretchable electronics device includes a first material having a particular electrical, mechanical or optical property; and a multi-block copolymer configured to form a hyperelastic binder that creates contact between the first material and the multi-block copolymer, in which the elastic composite material is structured to stretch at least 500% in at least one direction of the material and to exhibit the particular electrical, mechanical or optical property imparted from the first material. In some aspects, the stretchable electronics device includes a stretchable battery, biofuel cell, sensor, supercapacitor or other device able to be mounted to skin, clothing or other surface of a user or object.

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Research Organization:: Univ. of California, La Jolla, CA (United States)

Sponsoring Organization:: USDOE Advanced Research Projects Agency - Energy (ARPA-E); National Science Foundation (NSF)

DOE Contract Number:: AR0000535; ECCS-1542148

Assignee:: The Regents of the University of California (Oakland, CA)

Patent Number(s):: 11,678,436

Application Number:: 17/500,931

OSTI ID:: 1998492

Resource Relation:: Patent File Date: 10/13/2021

Country of Publication:: United States

Language:: English

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