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Integration of high permittivity BaTiO3 with AlGaN/GaN for near-theoretical breakdown field kV-class transistors

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/5.0070665· OSTI ID:1978976

In this Letter, we discuss AlGaN/GaN HEMTs integrated with high permittivity BaTiO3 dielectric to enable enhanced breakdown characteristics. We show that using high permittivity BaTiO3 dielectric layers in the gate and drain access regions prevents premature gate breakdown, leading to average breakdown fields exceeding 3 MV/cm at a gate-to-drain spacing of 4 μm. The higher breakdown fields enable a high power figure of merit above 2.4 GW/cm2 in devices with a gate-to-drain spacing of 6 μm. This work demonstrates that electrostatic engineering using high-permittivity dielectrics can enable AlGaN/GaN HEMTs in approaching the material breakdown field limits.

Research Organization:
Georgia Institute of Technology, Atlanta, GA (United States); The Ohio State University, Columbus, OH (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA); Air Force Office of Scientific Research (AFOSR)
Grant/Contract Number:
NA0003921
OSTI ID:
1978976
Alternate ID(s):
OSTI ID: 1829326
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 19 Vol. 119; ISSN 0003-6951
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English

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