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Evidence for nitrogen binding to surface defects for topological insulator Bi2Se3

Journal Article · · Solid State Communications
 [1];  [2];  [3];  [3];  [4];  [5];  [4];  [3];  [3]
  1. Michigan State Univ., East Lansing, MI (United States); Michigan State University
  2. Pacific Northwest National Lab. (PNNL), Richland, WA (United States)
  3. Michigan State Univ., East Lansing, MI (United States)
  4. Northwestern Univ., Evanston, IL (United States); Argonne National Lab. (ANL), Argonne, IL (United States)
  5. Argonne National Lab. (ANL), Argonne, IL (United States)
Using scanning tunneling spectroscopy and theoretical simulations we have studied the effects of nitrogen gas exposure on the electronic density of states of Bi2Se3, a well-studied topological insulator. In carefully controlled measurements, Bi2Se3 crystals were initially cleaved in a helium gas environment and then exposed to a 22 SCFH flow of ultra-high purity N2 gas. We observe a resulting change in the spectral curves, with the exposure effect saturating after approximately 50 min, ultimately bringing the Dirac point about 50 meV closer to the Fermi level. Furthermore, these results are compared to density functional theory calculations, which support a picture of N2 molecules physisorbing near Se vacancies. Furthermore, ab initio molecular dynamics simulations aided by a Blue Moon ensemble method reveal the dissociative adsorption of N2 molecules which then bind strongly to Se vacancies at the surface. In this scenario, the binding of the N atom to a Se vacancy site removes the surface defect state created by the vacancy and changes the position of the Fermi energy with respect to the Dirac point.
Research Organization:
Argonne National Laboratory (ANL), Argonne, IL (United States); Michigan State Univ., East Lansing, MI (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES); USDOE Office of Science (SC), Basic Energy Sciences (BES). Materials Sciences & Engineering Division (MSE)
Grant/Contract Number:
AC02-05CH11231; AC02-06CH11357; SC0017888
OSTI ID:
1960004
Alternate ID(s):
OSTI ID: 2340753
OSTI ID: 1899807
Journal Information:
Solid State Communications, Journal Name: Solid State Communications Vol. 359; ISSN 0038-1098
Publisher:
ElsevierCopyright Statement
Country of Publication:
United States
Language:
English

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Figures / Tables (4)


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