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Robust low-temperature (350 °C) ferroelectric Hf0.5Zr0.5O2 fabricated using anhydrous H2O2 as the ALD oxidant

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/5.0126695· OSTI ID:1923328
 [1];  [1];  [1];  [1];  [1];  [1];  [1];  [1];  [2];  [3];  [4];  [5];  [5];  [6];  [1]
  1. University of Texas at Dallas, Richardson, TX (United States)
  2. University of Texas at Dallas, Richardson, TX (United States); Inha University, Incheon (Korea, Republic of)
  3. Inha University, Incheon (Korea, Republic of)
  4. Brookhaven National Laboratory (BNL), Upton, NY (United States). Center for Functional Nanomaterials (CFN)
  5. RASIRC Inc., San Diego, CA (United States)
  6. Kangwon National University, Chuncheon (Korea, Republic of)

Here, in this Letter, the robust ferroelectric properties of low-temperature (350 °C) Hf0.5Zr0.5O2 (HZO) films are investigated. We demonstrate that the lower crystallization temperature of HZO films originates from a densified film deposition with an anhydrous H2O2 oxidant in the atomic layer deposition process. As a consequence of this densification, H2O2-based HZO films showed completely crystallinity with fewer defects at a lower annealing temperature of 350 °C. This reduction in the crystallization temperature additionally suppresses the oxidation of TiN electrodes, thereby improving device reliability. The low-temperature crystallization process produces an H2O2-based HZO capacitor with a high remanent polarization ( Pr), reduced leakage current, high breakdown voltage, and better endurance. Furthermore, while an O3-based HZO capacitor requires wake-up cycling to achieve stable Pr, the H2O2-based HZO capacitor demonstrates a significantly reduced wake-up nature. Anhydrous H2O2 oxidant enables the fabrication of a more reliable ferroelectric HZO device using a low process thermal budget (350 °C).

Research Organization:
Brookhaven National Laboratory (BNL), Upton, NY (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
Grant/Contract Number:
SC0012704
OSTI ID:
1923328
Report Number(s):
BNL-223935-2023-JAAM
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 22 Vol. 121; ISSN 0003-6951
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English

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