Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations

Kim, Dae-Hyeong; Song, Jizhou; Choi, Won Mook; Kim, Hoon-Sik; Kim, Rak-Hwan; Liu, Zhuangjian; Huang, Yonggang Y.; Hwang, Keh-Chih; Zhang, Yong-wei; Rogers, John A.

doi:10.1073/pnas.0807476105

Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations

Journal Article · Tue Dec 02 00:00:00 EST 2008 · Proceedings of the National Academy of Sciences of the United States of America

DOI:https://doi.org/10.1073/pnas.0807476105· OSTI ID:1875540

Kim, Dae-Hyeong ^[1]; Song, Jizhou ^[2]; Choi, Won Mook ^[3]; Kim, Hoon-Sik ^[4]; Kim, Rak-Hwan ^[4]; Liu, Zhuangjian ^[5]; Huang, Yonggang Y. ^[6]; Hwang, Keh-Chih ^[7]; Zhang, Yong-wei ^[8]; Rogers, John A. ^[4]

Univ. of Illinois at Urbana-Champaign, IL (United States); University of Illinois
Univ. of Miami, Coral Gables, FL (United States)
Samsung Advanced Inst. of Technology, Gyeonggi-Do (Korea, Republic of)
Univ. of Illinois at Urbana-Champaign, IL (United States)
Inst. of High Performance Computing, Connexis (Singapore)
Northwestern Univ., Evanston, IL (United States)
Tsinghua Univ., Beijing (China)
Inst. of High Performance Computing, Connexis (Singapore); National Univ. of Singapore (Singapore)

Electronic systems that offer elastic mechanical responses to high-strain deformations are of growing interest because of their ability to enable new biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This article introduces materials and mechanical design strategies for classes of electronic circuits that offer extremely high stretchability, enabling them to accommodate even demanding configurations such as corkscrew twists with tight pitch (e.g., 90° in ≈1 cm) and linear stretching to “rubber-band” levels of strain (e.g., up to ≈140%). The use of single crystalline silicon nanomaterials for the semiconductor provides performance in stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators, and differential amplifiers, suggest a valuable route to high-performance stretchable electronics.

View Accepted Manuscript (DOE)

Research Organization:: Univ. of Illinois at Urbana-Champaign, IL (United States)

Sponsoring Organization:: National Science Foundation; USDOE Office of Science (SC), Basic Energy Sciences (BES). Materials Sciences & Engineering Division

Grant/Contract Number:: FG02-07ER46453; FG02-07ER46471

OSTI ID:: 1875540

Journal Information:: Proceedings of the National Academy of Sciences of the United States of America, Journal Name: Proceedings of the National Academy of Sciences of the United States of America Journal Issue: 48 Vol. 105; ISSN 0027-8424

Publisher:: National Academy of SciencesCopyright Statement

Country of Publication:: United States

Language:: English

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The rise of flexible electronics in neuroscience, from materials selection to in vitro and in vivo applications Maiolo, L.; Polese, D.; Convertino, A. Advances in Physics: X, Vol. 4, Issue 1 https://doi.org/10.1080/23746149.2019.1664319	journal	January 2019
Dissolvable tattoo sensors: from science fiction to a viable technology Cheng, Huanyu; Yi, Ning Physica Scripta, Vol. 92, Issue 1 https://doi.org/10.1088/0031-8949/92/1/013001	journal	November 2016
Transfer of thin Au films to polydimethylsiloxane (PDMS) with reliable bonding using (3-mercaptopropyl)trimethoxysilane (MPTMS) as a molecular adhesive Byun, Ikjoo; Coleman, Anthony W.; Kim, Beomjoon Journal of Micromechanics and Microengineering, Vol. 23, Issue 8 https://doi.org/10.1088/0960-1317/23/8/085016	journal	July 2013
Fabrication and characterization of double curvature bendable silicon wafers Lips, Bram; Puers, Robert Journal of Micromechanics and Microengineering, Vol. 28, Issue 11 https://doi.org/10.1088/1361-6439/aadbd0	journal	September 2018
A review on stretchable magnetic field sensorics Melzer, M.; Makarov, D.; Schmidt, O. G. Journal of Physics D: Applied Physics, Vol. 53, Issue 8 https://doi.org/10.1088/1361-6463/ab52cf	journal	December 2019
Eraser-based eco-friendly fabrication of a skin-like large-area matrix of flexible carbon nanotube strain and pressure sensors Sahatiya, Parikshit; Badhulika, Sushmee Nanotechnology, Vol. 28, Issue 9 https://doi.org/10.1088/1361-6528/aa5845	journal	January 2017
3D printed stretchable capacitive sensors for highly sensitive tactile and electrochemical sensing Li, Kai; Wei, Hong; Liu, Wenguang Nanotechnology, Vol. 29, Issue 18 https://doi.org/10.1088/1361-6528/aaafa5	journal	March 2018
Flexible devices: from materials, architectures to applications Zou, Mingzhi; Ma, Yue; Yuan, Xin Journal of Semiconductors, Vol. 39, Issue 1 https://doi.org/10.1088/1674-4926/39/1/011010	journal	January 2018
Stretchable metal films Mechael, Sara S.; Wu, Yunyun; Schlingman, Kory Flexible and Printed Electronics, Vol. 3, Issue 4 https://doi.org/10.1088/2058-8585/aae8c0	journal	November 2018
Mechanics and thermal management of stretchable inorganic electronics Song, Jizhou; Feng, Xue; Huang, Yonggang National Science Review, Vol. 3, Issue 1 https://doi.org/10.1093/nsr/nwv078	journal	November 2015
A Conformal, Bio-Interfaced Class of Silicon Electronics for Mapping Cardiac Electrophysiology Viventi, J.; Kim, D.-H.; Moss, J. D. Science Translational Medicine, Vol. 2, Issue 24, p. 24ra22-24ra22 https://doi.org/10.1126/scitranslmed.3000738	journal	March 2010
Effect of film thickness on the stretchability and fatigue resistance of Cu films on polymer substrates Kim, Byoung-Joon; Shin, Hae-A-Seul; Lee, Ji-Hoon Journal of Materials Research, Vol. 29, Issue 23 https://doi.org/10.1557/jmr.2014.339	journal	November 2014
Inorganic dissolvable electronics: materials and devices for biomedicine and environment Cheng, Huanyu Journal of Materials Research, Vol. 31, Issue 17 https://doi.org/10.1557/jmr.2016.289	journal	August 2016
Self-Powered Flexible Blood Oxygen Monitoring System Based on a Triboelectric Nanogenerator Chen, Huamin; Xu, Yun; Zhang, Jiushuang Nanomaterials, Vol. 9, Issue 5 https://doi.org/10.3390/nano9050778	journal	May 2019

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