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Edge termination in vertical GaN diodes: Electric field distribution probed by second harmonic generation

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/5.0096755· OSTI ID:1872812

We characterized the electric field distribution of GaN-on-GaN p–n diodes with partially compensated ion-implanted edge termination (ET) using an electric field induced second harmonic generation technique (EFISHG). The distributed electric field from the anode to the outer edge of the ET demonstrates the effectiveness of the ET structure. However, EFISHG also shows that its effectiveness is strongly dependent on the acceptor charge distribution in the ET's partially compensated layer (PC). A generally lower amount of acceptor charge can be inferred from the measured electric field distribution resulting from excessive ion implantation energy or dose during ET fabrication and causing lower than optimal breakdown voltage. Localized field crowding can be observed when the remaining acceptors uncompensated by the implant in the PC layer are nonuniformly distributed around the periphery of the devices. Important information can be obtained from these direct electric field measurements and used for optimizing the device design and fabrication process.

Sponsoring Organization:
USDOE Advanced Research Projects Agency - Energy (ARPA-E)
Grant/Contract Number:
AR0000446
OSTI ID:
1872812
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 24 Vol. 120; ISSN 0003-6951
Publisher:
American Institute of PhysicsCopyright Statement
Country of Publication:
United States
Language:
English

References (22)

Ion-Implant Isolated Vertical GaN p-n Diodes Fabricated with Epitaxial Lift-Off From GaN Substrates journal December 2018
Electric field mapping of wide-bandgap semiconductor devices at a submicrometre resolution journal June 2021
Near unity ideality factor and Shockley-Read-Hall lifetime in GaN-on-GaN p-n diodes with avalanche breakdown journal December 2015
Leakage mechanisms in GaN-on-GaN vertical pn diodes journal June 2018
High voltage, high current GaN-on-GaN p-n diodes with partially compensated edge termination journal July 2018
Vertical GaN p-n Junction Diodes With High Breakdown Voltages Over 4 kV journal November 2015
1.7-kV and 0.55-$\text{m}\Omega \cdot \text {cm}^{2}$ GaN p-n Diodes on Bulk GaN Substrates With Avalanche Capability journal February 2016
High Performance Vertical GaN-on-GaN p-n Power Diodes With Hydrogen-Plasma-Based Edge Termination journal July 2018
High-Voltage Vertical GaN p-n Diodes by Epitaxial Liftoff From Bulk GaN Substrates journal November 2018
Design and Fabrication of GaN p-n Junction Diodes With Negative Beveled-Mesa Termination journal June 2019
High Voltage Vertical GaN p-n Diodes With Hydrogen-Plasma Based Guard Rings journal January 2020
Two-Step Mesa Structure GaN p-n Diodes With Low ON-Resistance, High Breakdown Voltage, and Excellent Avalanche Capabilities journal January 2020
Design and Fabrication of Ion-Implanted Moat Etch Termination Resulting in 0.7 m$\Omega\cdot$ cm 2 /1500 V GaN Diodes journal February 2020
Trap-Mediated Avalanche in Large-Area 1.2 kV Vertical GaN p-n Diodes journal September 2020
Vertical Power p-n Diodes Based on Bulk GaN journal February 2015
Vertical GaN Power Diodes With a Bilayer Edge Termination journal January 2016
Simulations of Junction Termination Extensions in Vertical GaN Power Diodes journal May 2017
Design and Fabrication of Vertical GaN p-n Diode With Step-Etched Triple-Zone Junction Termination Extension journal September 2020
Vertical GaN Power Devices: Device Principles and Fabrication Technologies—Part I journal July 2021
Demonstration of >6.0-kV Breakdown Voltage in Large Area Vertical GaN p-n Diodes With Step-Etched Junction Termination Extensions journal April 2022
Review of Recent Progress on Vertical GaN-Based PN Diodes journal June 2021
5.0 kV breakdown-voltage vertical GaN p–n junction diodes journal February 2018

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