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On the elastocaloric effect in CuAlBe shape memory alloys: A quantitative phase-field modeling approach

Journal Article · · Computational Materials Science
 [1];  [2]
  1. Colorado School of Mines, Golden, CO (United States); Colorado School of Mines, Golden, CO (United States)
  2. Colorado School of Mines, Golden, CO (United States)
We report the reversible stress-induced phase transformation in shape memory alloys (SMAs) is a dissipative process during which heat is absorbed or released. The inherent temperature variations inside the material has an elastocaloric effect (eCE) with appealing applications in solid-state cooling technology such as compact and efficient on-board refrigeration system for eletronic devices. In this manuscript, we conduct the first study of eCE of CuAlBe SMAs utilizing phase-field modeling. For an applied stress of 500 MPa, the results for polycrystalline Cu-Al11-2Be (at. %) show a minimum adiabatic unloading temperature change of -10 K over a pseudoelastic window of 40 K. In the absence of plastic deformation, the material demonstrates good reproducibility of the eCE over a few loading–unloading cycles. The presence of plastic deformation is found to cause functional fatigue that deteriorates the cooling capacity; however, the coefficient of performance only decreases from 9.04 to 8.03, which is still a very good value. These results place CuAlBe as a frontrunner SMA for solid-state cooling compared to the expensive NiTi.
Research Organization:
Colorado School of Mines, Golden, CO (United States)
Sponsoring Organization:
National Natural Science Foundation of China; Shandong Province Key Research and Development Program; USDOE; USDOE Office of Science (SC), Basic Energy Sciences (BES)
Grant/Contract Number:
SC0019279
OSTI ID:
1853008
Alternate ID(s):
OSTI ID: 1630987
Journal Information:
Computational Materials Science, Journal Name: Computational Materials Science Journal Issue: C Vol. 183; ISSN 0927-0256
Publisher:
ElsevierCopyright Statement
Country of Publication:
United States
Language:
English

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  • Bruederlin, Florian; Bumke, Lars; Quandt, Eckhard
  • 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) https://doi.org/10.1109/TRANSDUCERS.2019.8808605
conference June 2019
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