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SOMAFOAM: An OpenFOAM based solver for continuum simulations of low-temperature plasmas

Journal Article · · Computer Physics Communications
 [1];  [2]
  1. Univ. of California, Merced, CA (United States); Univ. of California, Merced, CA (United States)
  2. Univ. of California, Merced, CA (United States)
Here, we report the development of SOMAFOAM, a finite volume framework for performing continuum simulations of low-temperature plasmas. The primary goal of this work is to discuss the features of SOMAFOAM along with representative results provided as examples for a range of operating conditions and geometries. This includes plasma and plasma–dielectric systems operating in direct current, radio frequency, and microwave regimes from pressures as low as 100 mTorr to atmospheric pressure. The code has several useful features including the ability to run massively parallel simulations using arbitrary geometries, structured/unstructured meshes, choice of models such as drift–diffusion/full-momentum at runtime, and species-dependent timesteps to name a few. The verification/validation studies presented include comparison with previously published continuum simulations (low-pressure direct current and radio frequency plasma), with experiments (Gaseous Electronics Conference Reference Cell and microwave microplasma ignited in a split ring resonator), and previously published kinetic simulations (low-pressure radio frequency plasma). Other examples provided include a direct current atmospheric pressure microplasma bounded by dielectric sidewalls and a helium–nitrogen plasma ignited using a needle electrode facing a dielectric. The performance of the code is also discussed with serial and distributed memory parallel runs demonstrated up to 512 cores. The design and implementation of the code in a modular object-oriented framework allows for easy extension and seamless coupling with other codes and can be expected to play an important role in both academia and industry.
Research Organization:
Univ. of California, Merced, CA (United States)
Sponsoring Organization:
Applied Materials; Guru Gobind Singh Fellowship; USDOE Office of Science (SC), Fusion Energy Sciences (FES)
Grant/Contract Number:
SC0019044
OSTI ID:
1852789
Alternate ID(s):
OSTI ID: 1775686
Journal Information:
Computer Physics Communications, Journal Name: Computer Physics Communications Journal Issue: C Vol. 263; ISSN 0010-4655
Publisher:
ElsevierCopyright Statement
Country of Publication:
United States
Language:
English

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