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Title: Conductive heat spreader and heat sink assembly for optical devices

Patent ·
OSTI ID:1805588
;

Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.

Research Organization:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
B621073
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Number(s):
10,937,671
Application Number:
16/358,383
OSTI ID:
1805588
Resource Relation:
Patent File Date: 03/19/2019
Country of Publication:
United States
Language:
English

References (15)

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Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips patent May 2010
Conductive heat spreader and heat sink assembly for optical devices patent April 2019
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Free Space Fiber-Optic Connector patent-application March 2016
Tailorable titanium-tungsten alloy material thermally matched to semiconductor substrates and devices patent October 2014
Integrated Thermoelectric Cooling for Silicon Photonics journal January 2017
Chip packaging technique patent November 2001
Microsystem packaging and associated methods patent-application March 2004
High Power Laser Package with Vapor Chamber patent-application December 2010

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