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Title: Conductive heat spreader and heat sink assembly for optical devices

Abstract

Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.

Inventors:
;
Publication Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1568247
Patent Number(s):
10,269,592
Application Number:
15/827,562
Assignee:
International Business Machines Corporation (Armonk, NY)
DOE Contract Number:  
B621073
Resource Type:
Patent
Resource Relation:
Patent File Date: 11/30/2017
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Doany, Fuad Elias, and Schultz, Mark. Conductive heat spreader and heat sink assembly for optical devices. United States: N. p., 2019. Web.
Doany, Fuad Elias, & Schultz, Mark. Conductive heat spreader and heat sink assembly for optical devices. United States.
Doany, Fuad Elias, and Schultz, Mark. Tue . "Conductive heat spreader and heat sink assembly for optical devices". United States. https://www.osti.gov/servlets/purl/1568247.
@article{osti_1568247,
title = {Conductive heat spreader and heat sink assembly for optical devices},
author = {Doany, Fuad Elias and Schultz, Mark},
abstractNote = {Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.},
doi = {},
url = {https://www.osti.gov/biblio/1568247}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {4}
}

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