Conductive heat spreader and heat sink assembly for optical devices
Patent
·
OSTI ID:1568247
Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.
- Research Organization:
- International Business Machines Corporation, Armonk, NY (United States)
- Sponsoring Organization:
- USDOE
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- Patent Number(s):
- 10,269,592
- Application Number:
- 15/827,562
- OSTI ID:
- 1568247
- Country of Publication:
- United States
- Language:
- English
Integrated Thermoelectric Cooling for Silicon Photonics
|
journal | January 2017 |
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