Integrated package of electron cyclotron emission imaging data processing and forward modeling in OMFIT
Journal Article
·
· Review of Scientific Instruments
- Univ. of California, Davis, CA (United States); University of California, Davis
- Univ. of California, Davis, CA (United States)
- General Atomics, San Diego, CA (United States)
- Southwestern Inst. of Physics, Sichuan (China)
- Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
- Princeton Plasma Physics Lab. (PPPL), Princeton, NJ (United States)
An Electron Cyclotron Emission Imaging (ECEI) data analysis module has been developed for the OMFIT platform to accommodate the needs of users at the DIII-D tokamak for physics applications. The user can easily access the ECEI spatial observation windows in the plasma that are calculated based on the automatically retrieved hardware setup and available DIII-D equilibria, perform spectral analysis, and make 2D electron temperature fluctuation images. The module provides a powerful data post processing package for extracting important physics parameters from the 2D measurements, including the radial structure and poloidal mode number of Alfven Eigenmodes, as well as the frequency-vs-wavenumber dispersion relationship of broadband MHD. Lastly, the module propagates characterized synthetic fluctuations for the user, so one can perform forward modeling tasks with simple analytical fluctuations.
- Research Organization:
- Univ. of California, Davis, CA (United States)
- Sponsoring Organization:
- USDOE; USDOE Office of Science (SC), Basic Energy Sciences (BES). Scientific User Facilities Division; USDOE Office of Science (SC), Fusion Energy Sciences (FES)
- Grant/Contract Number:
- FC02-04ER54698; FG02-99ER54531; SC0017992
- OSTI ID:
- 1777988
- Alternate ID(s):
- OSTI ID: 1772160
- Journal Information:
- Review of Scientific Instruments, Journal Name: Review of Scientific Instruments Journal Issue: 3 Vol. 92; ISSN 0034-6748
- Publisher:
- American Institute of Physics (AIP)Copyright Statement
- Country of Publication:
- United States
- Language:
- English
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