Recovery from plasma etching-induced nitrogen vacancies in p-type gallium nitride using UV/O3 treatments
- Naval Research Lab. (NRL), Washington, DC (United States)
- The Ohio State Univ., Columbus, OH (United States). Dept. of Physics
- The Ohio State Univ., Columbus, OH (United States). Dept. of Physics and Dept. of Electrical and Computer Engineering
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Plasma etching of p-type GaN creates n-type nitrogen vacancy (VN) defects at the etched surface, which can be detrimental to device performance. In mesa isolated diodes, etch damage on the sidewalls degrades the ideality factor and leakage current. Here a treatment was developed to recover both the ideality factor and leakage current, which uses UV/O3 treatment to oxidize the damaged layers followed by HF etching to remove them. The temperature dependent I–V measurement shows that the reverse leakage transport mechanism is dominated by Poole–Frenkel emission at room temperature through the etch-induced VN defect. Depth resolved cathodoluminescence confirms that the damage is limited to first several nanometers and is consistent with the VN defect.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE Advanced Research Projects Agency - Energy (ARPA-E); US Department of the Navy, Office of Naval Research (ONR); US Air Force Office of Scientific Research (AFOSR); USDOE National Nuclear Security Administration (NNSA)
- Grant/Contract Number:
- AC04-94AL85000; NA0003525
- OSTI ID:
- 1667419
- Report Number(s):
- SAND--2020-9081J; 690271
- Journal Information:
- Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 8 Vol. 117; ISSN 0003-6951
- Publisher:
- American Institute of Physics (AIP)Copyright Statement
- Country of Publication:
- United States
- Language:
- English
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