Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

New laser plasma source for extreme-ultraviolet lithography

Journal Article · · Applied Optics
;  [1]
  1. Center for Research and Education in Optics and Lasers, University of Central Florida, 12424 Research Parkway, Orlando, Florida 32826 (United States)

As the demands of lithographic fabrication of computer chips push toward ever-decreasing feature sizes, projection extreme-ultraviolet (EUV) lithography becomes an increasingly attractive technology. The radiation source of choice for this approach is a laser plasma with a high repetition rate. We report an investigation of a new candidate laser plasma source for EUV lithography that is based on line emission from ice-water targets. This radiation source has the potential to meet all the strict requirements of EUV conversion, debris elimination, operation, and cost for a demonstration lithographic system.

Sponsoring Organization:
USDOE
OSTI ID:
165579
Journal Information:
Applied Optics, Journal Name: Applied Optics Journal Issue: 25 Vol. 34; ISSN APOPAI; ISSN 0003-6935
Country of Publication:
United States
Language:
English

Similar Records

Extreme ultraviolet lithography for circuit fabrication at 0.1 {micro}m feature size
Conference · Sat Dec 30 23:00:00 EST 1995 · OSTI ID:379725

Method for extreme ultraviolet lithography
Patent · Thu Dec 31 23:00:00 EST 1998 · OSTI ID:872784

Method for extreme ultraviolet lithography
Patent · Fri Dec 31 23:00:00 EST 1999 · OSTI ID:873452