Heat dissipation assembly
Patent
·
OSTI ID:1650775
A heat dissipating assembly including a layered stack of materials with a highly thermally conductive path for cooling a circuit, the stack including a structurally isolated material having a high coefficient of thermal expansion connected between materials having low coefficients of thermal expansion.
- Research Organization:
- Honeywell Federal Manufacturing & Technologies, LLC, Kansas City, MO (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- NA0000622
- Assignee:
- Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
- Patent Number(s):
- 10,622,277
- Application Number:
- 16/006,227
- OSTI ID:
- 1650775
- Country of Publication:
- United States
- Language:
- English
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