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Porous thermally insulating compositions containing hollow silica particles

Patent ·
OSTI ID:1650735
A thermally insulating composition comprising hollow spherical silica particles and a coating of a material having a thermal conductivity of less than 0.3 W/m·K on surfaces of said silica particles. In particular embodiments, the low conductivity coating material may be a polymer, such as polystyrene or polyvinylpyrrolidone, or the low conductivity coating material may be a quaternary ammonium salt of the Formula (1), i.e., R1R2R3R4N+A−, with at least one of R1, R2, R3, and R4 being an alkyl group containing at least ten carbon atoms (and A− is a counter anion), or the low conductivity coating material may be phenyl-C61-butyric acid methyl ester covalently bound to the hollow spherical silica particles. Also described herein is a method of thermally insulating a surface by applying a coating of the thermally insulating composition, described above, onto the surface.
Research Organization:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC05-00OR22725
Assignee:
UT-Battelle, LLC (Oak Ridge, TN)
Patent Number(s):
10,611,902
Application Number:
15/889,543
OSTI ID:
1650735
Country of Publication:
United States
Language:
English

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