Porous thermally insulating compositions containing hollow silica particles
A thermally insulating composition comprising hollow spherical silica particles and a coating of a material having a thermal conductivity of less than 0.3 W/m·K on surfaces of said silica particles. In particular embodiments, the low conductivity coating material may be a polymer, such as polystyrene or polyvinylpyrrolidone, or the low conductivity coating material may be a quaternary ammonium salt of the Formula (1), i.e., R1R2R3R4N+A−, with at least one of R1, R2, R3, and R4 being an alkyl group containing at least ten carbon atoms (and A− is a counter anion), or the low conductivity coating material may be phenyl-C61-butyric acid methyl ester covalently bound to the hollow spherical silica particles. Also described herein is a method of thermally insulating a surface by applying a coating of the thermally insulating composition, described above, onto the surface.
- Research Organization:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC05-00OR22725
- Assignee:
- UT-Battelle, LLC (Oak Ridge, TN)
- Patent Number(s):
- 10,611,902
- Application Number:
- 15/889,543
- OSTI ID:
- 1650735
- Resource Relation:
- Patent File Date: 02/06/2018
- Country of Publication:
- United States
- Language:
- English
Hollow-Structured Mesoporous Silica Material and Preparation Process
|
patent-application | November 2005 |
Hollow Silica Particle with a Polymer Thereon
|
patent-application | February 2012 |
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