Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Sub-10um Pitch Hybrid Direct Bond Interconnect Development for Die-to-Die Hybridization.

Conference ·
OSTI ID:1640140
Abstract not provided.
Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1640140
Report Number(s):
SAND2019-5696C; 675717
Country of Publication:
United States
Language:
English

Similar Records

Sub-10um Pitch Hybrid Direct Bond Interconnect Development for Die-to-Die Hybridization.
Conference · Thu Feb 28 23:00:00 EST 2019 · OSTI ID:1639286

Strategies relating to CMP for die to wafer interconnects utilizing hybrid direct bonding.
Conference · Fri Jan 31 23:00:00 EST 2020 · OSTI ID:1783623

Strategies relating to CMP for die to wafer interconnects utilizing hybrid direct bonding.
Conference · Fri May 01 00:00:00 EDT 2020 · OSTI ID:1783674

Related Subjects